Professional PCBA Design and Manufacturing
One-Stop PCBA Manufacturing Services Since 2009
Shenzhen YongChangTai Electronic Co., Ltd. provides integrated electronics manufacturing services covering PCBA design support, component sourcing, SMT and DIP assembly, programming, functional testing, burn-in, final assembly, packaging and shipment.
With manufacturing facilities in Shenzhen, experienced production teams and automated SMT equipment, we support customers from initial product development to prototype validation and volume production.
PCBA manufacturing and electronics assembly experience.
Automated SMT production capacity for prototypes and volume orders.
Daily SMT placement capacity based on the company’s current production configuration.
Manufacturing, testing, material management and engineering facilities.
A Shenzhen-Based PCBA Manufacturing Partner
Shenzhen YongChangTai Electronic Co., Ltd., also known as YCT, was established in March 2009 and is located in Bao’an District, Shenzhen, China.
Over the past 16 years, YCT has developed from a single PCBA processing provider into an integrated electronics manufacturing company. Our services cover PCBA design support, component procurement, SMT assembly, DIP insertion, post-soldering, programming, testing, product assembly and packaging.
Our factory covers approximately 4,000 square metres and is supported by automated SMT production lines, inspection equipment, reliability testing equipment, intelligent material management and MES-based production control.
Our Development Journey
Through continuous investment in production capacity, equipment, testing and manufacturing management, YCT has gradually developed into an integrated PCBA and electronics manufacturing service provider.
One-Stop Electronics Manufacturing Services
From early product evaluation to final delivery, YCT provides coordinated engineering, sourcing, manufacturing and testing services through one project management process.
PCBA Design
Our hardware and software engineers provide project evaluation, product development support and manufacturing feasibility review. Customers can share an initial product concept, functional requirement or existing design, and our team will help turn it into a manufacturable electronic product.
Component Sourcing
YCT provides component selection, procurement, BOM matching, overseas purchasing and material preparation services. We work with original manufacturers, agents and authorized distributors to support product development and production requirements.
SMT Assembly
Our SMT production services include automatic solder paste printing, SPI inspection, high-speed component placement, first article inspection, reflow soldering, AOI inspection and X-ray inspection.
DIP
We provide through-hole component insertion, wave soldering, post-soldering, lead trimming, depaneling, visual inspection and solder-joint inspection for mixed-technology PCBA products.
Functional Testing
Testing services include firmware programming, voltage and current testing, functional testing, RF testing, test-fixture testing and burn-in testing according to the customer’s product and test requirements.
Box Build & Final Assembly
YCT supports product assembly, ultrasonic cleaning, conformal coating, inspection, packaging and shipment, helping customers coordinate PCBA manufacturing and final product integration through one supplier.
PCBA Manufacturing Capabilities
Our production lines support a wide range of PCB sizes, component packages and assembly requirements. Each project is reviewed according to PCB design, component layout, testing requirements and production quantity.
| Capability | Specification |
|---|---|
| PCB Size | 50 × 50 mm to 510 × 460 mm |
| PCB Thickness | 0.5 mm to 4.0 mm |
| Minimum SMD Component | 01005 |
| Minimum IC Pitch Identifiable by AOI | 0.35 mm |
| Maximum Component Height | 21 mm |
| Chip Placement Accuracy | ±0.04 mm |
| IC Placement Accuracy | ±0.035 mm |
| Inspection Equipment | SPI, AOI and X-ray |
| Production Types | Prototype, small-batch and volume production |
| Service Models | Material supplied, partial turnkey and full turnkey |
Final manufacturability depends on PCB design, component package, assembly density and testing requirements. Please send your BOM and Gerber files for project evaluation.
Main Production and Inspection Equipment
Automatic Solder Paste Printer
Applies controlled solder paste deposits before SMT placement.
3D SPI Inspection
Checks solder paste height, area, volume and alignment before component placement.
High-Speed SMT Mounter
Supports high-speed and high-precision placement of chip components and ICs.
Reflow Oven
Controls the SMT soldering process through defined temperature zones.
AOI Inspection System
Inspects component presence, position, polarity and visible soldering conditions.
X-Ray Inspection
Inspects hidden solder joints beneath BGA, QFN and other bottom-terminated components.
Wave Soldering Equipment
Supports through-hole soldering for DIP and mixed-technology assemblies.
Functional Test
Verifies electrical functions, signals and product performance according to project requirements.
- +86 135 1008 2025
- Arvin@yctsz.com
- 3rd Floor, Building 3B, St. George Industrial Park, Xinyu Road, Shajing Street, Bao’an District, Shenzhen, China